Methods, apparatus, and systems for reducing interference on nearby conductors

ABSTRACT

In a method of data transmission according to one embodiment of the invention, data transitions having the same clock dependence are separated in space. In one such method, signals of one set are transmitted on corresponding conductive paths in one direction, signals of another set are transmitted on corresponding conductive paths in the other direction, and adjacent conductive paths that each carry a signal of one set are separated by at least one conductive path that carries a signal of another set. In an apparatus according to one embodiment of the invention, the conductive paths are fabricated on a semiconductor substrate.

BACKGROUND

[0001] 1. Field of the Invention

[0002] The present invention relates to information transmission. Morespecifically, the present invention relates to information transmissionalong conductive structures.

[0003] 2. Background Information

[0004] Buses of parallel conductors are commonly used on circuit boardsto carry data from one location to another. Problems associated with theuse of such buses include delays incurred during propagation of the datasignals and interference due to coupling of the conductors with oneanother.

[0005] Recently, it has become desirable to enable the use of buses ofparallel conductors on small-scale structures such as within anintegrated circuit (‘chip’). While the propagation delay may be minimalin such applications, undesirable coupling effects become moreproblematic. For example, capacitive coupling may occur between theparallel conductors, contributing to an increased impedance at highfrequencies that limits bandwidth and distorts signal features. Suchproblems may impose undesirable limits on the maximum clock speed, theminimum size and separation of the conductors, and/or the maximum lengthof the bus in a particular application.

[0006] Timing considerations are especially critical in high-speedintegrated circuits currently under development. In these circuits thetime between state changes is minimal, and any fluctuation in thetransition times may cause a delay that increases the error rate of thechip and decreases chip performance. In a chip clocked at 900 megahertz,for example, each cycle has a duration of only 1.1 nanosecond. If thetime required to propagate a state transition across a transmission lineis longer than a clock cycle, then the clock speed must be reduced.

[0007] As the conductors become more narrow and closer together, and asthe time between state transitions decreases (e.g. as the clock speedincreases), interference mechanisms that have negligible effects inother applications become limiting. In a 0.18-micron process, forexample, with a pitch of 0.4 microns per wire, coupling effects mayimpede operation at any speed above a few hundred megahertz. For suchreasons, chip designers commonly avoid long runs of parallel conductorsin their designs.

[0008] One effect of coupling interference is an alteration of statetransitions as they propagate over the conductors, resulting in a timeskew of the signals being transmitted. When a new value is clocked ontoa transmission line, an opposite current is induced in an adjacent(victim) transmission line. This induced current (or ‘crosstalk’) causesthe skewing of a signal being transmitted on the victim line.

[0009] Timing within a circuit or assembly may be of criticalimportance: for example, when circuitry at the emitting and/or receivingsides of the transmission line is controlled by a clock (such as withinan application-specific integrated circuit or ‘ASIC’). In such cases, analtered rise time of a state transition may result in a loss ofsynchronization between different parts of the circuit and the failureof the chip to perform properly. For example, a skew in rise time maycause a state change to be detected at the receiving side at a differenttime than was intended because the threshold voltage was reached beforeor after the intended time.

[0010] One method of reducing the effect of crosstalk among signals onparallel conductors includes increasing the power of the signal beforetransmission. As a result of recent advancements in integrated circuittechnologies, however, this method has become outdated. Reduction inintegrated circuit feature dimensions, for example, require a consequentreduction in the power supply voltages in order to maintain acceptablylow electric field intensities.

[0011] An alternative approach to reducing the effect of crosstalk is toshield each transmission line individually in order to reduce the degreeof crosstalk between adjacent lines. However, this method is also notviable for chip design because such shielding reduces the amount ofsurface area available on the chip for transmission lines and othercircuit elements. A method of adding additional lines with balancedcurrent and voltage values to counteract the effects of crosstalk andincrease the distance between adjacent signal lines suffers from thesame problem, as the additional lines will also consume surface area onthe chip.

[0012] Repeaters have been used along transmission lines to decrease thetotal transmission time to a level at which the skew of the signal isacceptable. In other words, because delay may be due to both the skewingof the state transition and the propagation time, a reduction in thepropagation time may reduce the total delay to an acceptable level.Again, however, such a method requires additional surface area on thechip (for the repeaters). Although methods exist to minimize the amountof space required for the repeaters, space limitations are still ofmajor concern to chip designers. Additionally, the signals outputted bythe repeaters may still interfere with signals on nearby conductors.

[0013] Reductions of scale and increased speeds associated with newintegrated circuit designs require new and innovative techniques toreduce interference during information transmission.

SUMMARY

[0014] In a method of data transmission according to an embodiment ofthe invention, data transitions on adjacent conductors are separated inspace. In one such method, sets of signals are transmitted oncorresponding conductive paths. Each signal from one set is transmittedfrom a first end of the corresponding conductive path to a second end,while each signal from another set is transmitted from a second end ofthe corresponding conductive path to a first end.

[0015] Adjacent conductive paths that each carry a signal of one set areseparated by at least one conductive path that carries a signal ofanother set. In one example, a first set of signals is transmitted inone direction on a first set of parallel conductors, and a second set ofsignals is transmitted in the opposite direction on a second set ofparallel conductors that is interleaved with the first set.

[0016] The transmissions in both directions may occur on the samesemiconductor substrate. Moreover, a propagation delay of a statetransition across one of the parallel conductors may be less than a timeinterval between consecutive state transitions on that conductor.

[0017] Each conductive path may include a corresponding one of aplurality of transmission lines. In one example, at least one set ofsignals has a series of state transitions synchronized to a clocksignal, and one of the transmission lines carries the clock signal. Inanother example, each conductive path includes a buffer.

[0018] Additional embodiments of the invention include datatransmitters, data receivers, systems including data transmitters andreceivers, and systems including more than one data transmitter.

BRIEF DESCRIPTION OF THE DRAWINGS

[0019]FIG. 1 is a block diagram showing an application of a transmitter10 according to an embodiment of the invention.

[0020]FIG. 2 is an exemplary illustration of time relations betweensignals in the application of FIG. 1.

[0021]FIG. 3 is a block diagram of an application of an implementation12 of a transmitter 10 according to an embodiment of the invention.

[0022]FIG. 4 is an exemplary illustration of time relations betweensignals in the application of FIG. 3.

[0023]FIG. 5 is a block diagram of an application of an implementation12 of a transmitter 10 according to an embodiment of the invention.

[0024]FIG. 6 is a block diagram of an implementation 100 of atransmitter 10 according to an embodiment of the invention.

[0025]FIG. 7 is a block diagram of an implementation 200 of atransmitter 10 according to an embodiment of the invention.

[0026]FIG. 8 is a block diagram of an implementation 102 of atransmitter 10 according to an embodiment of the invention.

[0027]FIG. 9 is a block diagram of an implementation 202 of atransmitter 10 according to an embodiment of the invention.

[0028]FIG. 10 is a block diagram of an implementation 104 a of atransmitter 10 according to an embodiment of the invention.

[0029]FIG. 11 is a block diagram of an implementation 104 b of atransmitter 10 according to an embodiment of the invention.

[0030]FIG. 12 is a block diagram of an implementation 106 of atransmitter 10 according to an embodiment of the invention.

[0031]FIG. 13 is a block diagram of an implementation 204 of atransmitter 10 according to an embodiment of the invention.

[0032]FIG. 14 is a block diagram of an implementation 206 of atransmitter 10 according to an embodiment of the invention.

[0033]FIG. 15 is a block diagram of an implementation 208 of atransmitter 10 according to an embodiment of the invention.

[0034]FIG. 16 is a block diagram of an implementation 210 of atransmitter 10 according to an embodiment of the invention.

[0035]FIG. 17 is a block diagram showing an application of a transmitter10 and a receiver 112 according to an embodiment of the invention.

[0036]FIG. 18 is a block diagram of an implementation 500 of a receiver112 according to an embodiment of the invention.

[0037]FIG. 19 is a block diagram of an implementation 502 of a receiver112 according to an embodiment of the invention.

[0038]FIG. 20 is a block diagram of an implementation 504 of a receiver112 according to an embodiment of the invention.

[0039]FIG. 21 is a block diagram of an implementation 506 of a receiver112 according to an embodiment of the invention.

[0040]FIG. 22 is a block diagram showing an application of a transmitter14 according to an embodiment of the invention.

[0041]FIGS. 23A, 23B are illustrations showing transitions of signalstransmitted on transmission lines that have opposite series of invertingand non-inverting buffers.

[0042]FIG. 24 is a block diagram showing an application of a transmitter14 according to an embodiment of the invention.

[0043]FIG. 25 is a block diagram showing an application of a transmitter14 according to an embodiment of the invention.

[0044]FIG. 26 is a block diagram showing an application of animplementation 106 a of a transmitter 10 according to an embodiment ofthe invention.

[0045]FIG. 27 is a block diagram showing an application of animplementation 106 b of a transmitter 10 according to an embodiment ofthe invention.

[0046]FIG. 28 is a block diagram showing an application of two instances16-1 and 16-2 of an implementation 16 of a transmitter 10 according toan embodiment of the invention.

[0047]FIG. 29 is a block diagram showing an application of two instances18-1 and 18-2 of an implementation 18 of a transmitter 10 according toan embodiment of the invention.

[0048]FIG. 30 is a block diagram showing an application of two instances300-1 and 300-2 of an implementation 300 of a transmitter 10 accordingto an embodiment of the invention.

[0049]FIG. 31 is a block diagram showing an application of twoimplementations 300 and 302 of a transmitter 10 according to anembodiment of the invention.

[0050]FIG. 32 is a block diagram showing an application of two instances300-1 and 300-2 of an implementation 300 of a transmitter 10 accordingto an embodiment of the invention.

[0051]FIG. 33 is a block diagram showing an application of twoimplementations 300 and 304 of a transmitter 10 according to anembodiment of the invention.

[0052]FIG. 34 is a block diagram showing an application of two instances16-1 and 16-2 of an implementation 16 of a transmitter 10 according toan embodiment of the invention.

[0053]FIG. 35 is a block diagram showing an application of two instances16-1 and 16-2 of an implementation 16 of a transmitter 10 according toan embodiment of the invention.

[0054]FIG. 36 is a block diagram showing an application of two instances306-1 and 306-2 of an implementation 306 of a transmitter 10 accordingto an embodiment of the invention.

DETAILED DESCRIPTION

[0055] Signal transmission on sets of conductors may be performed inseveral different contexts. Between circuit units or assemblies, forexample, signals may be transmitted across distances of centimeters ormeters on a ribbon cable or another cable having parallel conductors. Ina printed circuit board, signals may be transmitted on parallelconductive traces across distances of millimeters or centimeters. In asemiconductor chip, signals may be transmitted across distances ofmillimeters or microns on parallel conductive paths or structures thatmay be formed (e.g. deposited or etched) on a substrate.

[0056] As the characteristics of the signals (such as clock speed)change, effects that were negligible or undetectable in anotherapplication may become significant or even limiting. As signalfrequencies increase, for example, capacitive effects may allowconduction between nearby conductors, resulting in crosstalk betweensignals.

[0057] Conductor dimensions may include the length, width, and thicknessof each conductor; the feature pitch (characterizing the separationbetween conductors as measured on the substrate surface); and thevertical separation between conductors. As conductor dimensions and/orrelations between those dimensions change, effects that were negligibleor undetectable in another application may become significant or evenlimiting.

[0058] In wafer-scale-integration applications, for example, conductivepaths less than one-half micron wide (and less than one-half micronapart) may extend in parallel buses that are dozens of centimeters long(i.e. for a length-to-width ratio of 10⁶ or more). In one suchapplication, a number of interconnected cells are fabricated on a singlesemiconductor substrate that may have a diameter of ten to thirtycentimeters. One structure of this class (also called large-areaintegrated circuits or LAICs) holds an array of tens to thousands ofcells that communicate over buses having dozens of conductive paths andlengths of ten to thirty centimeters. In one such example, a bus hasforty parallel conductive paths and a length of up to twelve inches.

[0059] The signals transmitted on a set of conductors may have severaldifferent forms. For example, a portion of the set of conductors mayform a parallel signal bus, with each conductor carrying a designatedbit of a multi-bit information value (e.g. a byte or word). In anotherexample, one or more of the conductors may carry data values serially.In a further example, one or more of the conductors may carry otherinformation such as parity or other error-control information, sourceand/or destination information, control values, a clock signal, etc.

[0060] In a method for reducing interaction between signals on nearbyconductors according to one embodiment of the invention, datatransitions on adjacent conductors are separated in time.

[0061]FIG. 1 shows a block diagram of an application of animplementation 10 of a transmitter according to an embodiment of theinvention. Transmitter 10 receives two sets of input signals S10 a, S10b and transmits two sets of corresponding output signals S20 a, S20 b ona set of conductive paths 15. In an exemplary implementation, conductivepaths 15 are parallel to one another.

[0062] A time T1 is defined as the period between a state transition onan input signal S10 b and the corresponding state transition on thecorresponding output signal S20 b. A time T2 is defined as the periodbetween a state transition on an input signal S10 a and thecorresponding state transition on the corresponding output signal S20 a.In the application shown in FIG. 1, time T2 exceeds time T1 by a delayperiod T_DLY.

[0063]FIG. 2 shows a timing diagram for an exemplary application oftransmitter 10 as shown in FIG. 1. In this example, each signal S10carries a series of binary values, with a transition from one value tothe other being indicated by a state transition synchronous to a risingedge of a data clock signal. Relations between signals as shown in FIG.2 are presented by way of example only and are not intended to representlimitations on the practice of the invention or of the application shownin FIG. 1.

[0064]FIG. 3 shows a block diagram of an application of animplementation 12 of transmitter 10 according to an embodiment of theinvention. In this application, transmitter 12 transmits each outputsignal S20 on a corresponding one of a set of parallel transmissionlines 20. In one example, one or more of transmission lines 20 mayinclude one or more buffers. These buffers (or repeaters) may be used toregenerate the signal and preserve signal bandwidth.

[0065] Transmitter 12 also receives a clock signal CLK0. Clock signalCLK0 may have a duty cycle of 50% with substantially equal rise and falltimes, although such features are not required for practice of theinvention. In one example, clock signal CLK0 has a period of 8nanoseconds (ns) and a rise time of 1 ns.

[0066]FIG. 4 shows a timing diagram for an exemplary application oftransmitter 12 as shown in FIG. 3. In this example, clock signal CLK0has the same frequency as the data clock signal. In other applications,the data clock may be the same as clock signal CLK0. In furtherapplications, one or more of the input signals S10 may be timedaccording to a different frequency or offset than another of the inputsignals S10. Relations between signals as shown in FIG. 4 are presentedby way of example only and are not intended to represent limitations onthe practice of the invention or of the implementation shown in FIG. 3.

[0067] In an exemplary implementation, delay period T_DLY is less thanthe period T_CLK of the data clock signal. In a further example, delayperiod T_DLY is at least two times the length of the rise time of thedata clock signal.

[0068]FIG. 5 shows a block diagram of an application of animplementation 12 of transmitter 10 according to an embodiment of theinvention. In this application, clock signal CLK0 is transmitted on atransmission line 20 c 1 parallel to the transmission lines 20 thatcarry output signals S20. In another application, transmitter 12transmits clock signal CLK0 onto transmission line 20 c 1.

[0069]FIG. 6 shows a block diagram of an implementation 100 oftransmitter 10. Transmitter 100 includes a set of first latches 110 athat receive clock signal CLK0 and input signals S10 a. In response to aspecified state transition of clock signal CLK0 (e.g. a rising orfalling edge), first latches 110 a latch the data values on inputsignals S10 a onto output signals S20 a. First latches 110 a may beimplemented using flip-flops (e.g. as shown in FIG. 6) and/or othersequential logic devices.

[0070] Transmitter 100 also includes a set of second latches 110 b thatreceive clock signal CLK0 and input data signals S10 b. Upon thespecified state transition of clock signal CLK0, second latches 110 blatch the data values on input signals S10 b onto the inputs of delayelements 120. Second latches 110 b may be implemented using flip-flopsand/or other sequential logic devices. After a predetermined delay(which may be the same for all delay elements 120 or may differ amongthem), delay elements 120 impose the data values onto the respectiveoutput signals S20 b.

[0071] Transmitter 100 produces output signals S20 for transmissionacross a set of conductive paths (e.g. as shown in FIGS. 1, 3, and 5),the output signals S20 being arranged such that adjacent conductivepaths that carry outputs signals S20 b are separated by at least oneconductive path that carries an output signal S20 a. In an exemplaryapplication, no two output signals 20 a are carried over adjacentconductive paths and no two output signals 20 b are carried overadjacent conductive paths. Because transitions on the signals S20 b aredelayed with respect to those on the signals S20 a, it may be understoodthat data transitions on adjacent conductors are separated in time.

[0072] It may be desirable to perform the time separation among theoutput signals S20 by inserting one or more delay elements into a clockpath rather than (or in addition to) inserting delay elements into oneor more signal paths. FIG. 7 shows a block diagram of an alternativeimplementation 200 of a transmitter 100 according to an embodiment ofthe invention. Transmitter 200 includes a set of first latches 110 athat receive a clock signal CLK0 and input data signals S10 a. As above,in response to a specified state transition of clock signal CLK0 (e.g. arising or falling edge), first latches 110 a latch the data values oninput signals S10 a onto output signals S20 a.

[0073] Transmitter 200 includes a delay element 220-1, which receivesclock signal CLK0 and produces a clock signal D_CLK0 having apredetermined delay with respect to clock signal CLK0. Transmitter 200also includes a set of second latches 110 b that receive input datasignals S10 b and delayed clock signal D_CLK0. In response to aspecified state transition of delayed clock signal D_CLK0, secondlatches 110 b latch the data values on input signals S10 b onto outputsignals S20 b. In one implementation, delay element 220-1 introduces apredetermined delay that is variable (e.g. according to a control signalfrom a control unit).

[0074] In a transmitter according to implementation 100, it may bedesirable for the delays introduced by delay elements 120 to have valuesat least twice the rise time of clock signal CLK0 and no greater thanone-half of the period of clock signal CLK0. In a transmitter accordingto implementation 200, it may be desirable for delayed clock signalD_CLK to be delayed with respect to clock signal CLK0 by a value that isat least twice the rise time of clock signal CLK0 and no greater thanone-half of the period of clock signal CLK0. Particular delay values maybe selected for specific applications (e.g. based on simulations) tominimize interaction among transitions on the conductive paths.

[0075] As compared to transmitter 100, transmitter 200 may beconstructed using fewer delay elements (in these particular examples,one delay element as compared to N/2 delay elements, where N is thetotal number of signal lines S10). Transmitter 200 may also exhibit amore uniform power consumption over time, as no more than half of thelatches in transmitter 200 switch at any given time (for an applicationin which the number of output signals S20 a equals the number of outputsignals S20 b). Additionally, for transmitter 200 as shown in FIG. 7,the number of conductive paths is not a factor in the number of delays:regardless of the number of conductors, one delay is sufficient toachieve a separation in time of data transitions on adjacent conductors.This feature may support a longer life expectancy of transmitter 200and/or of an integrated circuit that includes transmitter 200.

[0076] In some applications, it may be desirable to pass one or more ofthe output signals S20 through a buffer prior to transmission on theconductive paths (e.g. transmission lines). For example, a buffer 130may be used to boost the signal to an acceptable level for the intendedreceiver or to reduce the impact of a capacitive load (e.g. as may beencountered in a long transmission line). FIGS. 8 and 9 showimplementations 102 and 202 of transmitters 100 and 200, respectively,that include buffers 130. In an exemplary implementation, a buffer 130is implemented as two consecutive inverters, with the second inverteroutputting a stronger signal (e.g. having larger transistors) than thefirst inverter.

[0077] It may be desirable to increase the separation in space betweendata transitions that may interfere. For example, it may be desirable toincrease the distance between conductive paths carrying similarly timeddata transitions.

[0078]FIG. 10 shows a block diagram of an implementation 104 a oftransmitter 10 according to an embodiment of the invention in which morethan one other output signal S20 separates adjacent output signals S20having the same clock dependence. In this example, output signals S20 aare not delayed, output signals S20 b are delayed (via delay elements120 b) by a first delay period, and output signals S20 c are delayed(via delay elements 120 c) by a second delay period that is longer thanthe first delay period. Further implementations may be configured toinclude output signals S20 having other delay periods, with theconductive paths being arranged to minimize signal interaction (e.g. inorder of increasing delay periods as shown in FIG. 10). It may bedesirable for the shortest delay period between adjacent conductors tohave a value that is at least twice the rise time of clock signal CLK0and for the longest delay period among the set of conductors to have avalue that is no greater than one-half of the period of clock signalCLK0.

[0079]FIG. 11 shows a block diagram of an alternative implementation 104b of a transmitter 104 a as shown in FIG. 10. In this example, the delayelements 120 all have the same delay period, such that output signalsS20 c are delayed by twice the delay period of output signals S20 b.

[0080] In some cases, it may be desirable to have a uniform delayseparation between the output signals on adjacent conductors. FIG. 12shows a block diagram of an implementation 106 of transmitter 100according to an embodiment of the invention that has a time separationof one delay unit between output signals S20 on adjacent conductors (inthis example, delay elements 120 all have the same delay period).

[0081]FIG. 13 shows a block diagram of a transmitter 204 having multipledelayed clock signals D_CLK0, D2_CLK0 in which adjacent output signalsS20 having the same clock dependence are separated by more than oneother output signal S20. FIG. 14 shows a block diagram of a transmitter206 having multiple delayed clock signals whose output signals S20 havemutual time relations that are similar to those of the output signalsS20 of transmitter 106 as shown in FIG. 12.

[0082] One possible advantage of an implementation 204 of a transmitteras shown in FIG. 13 is that each delay element may be loaded evenly (ornearly evenly), while in an implementation 206 of a transmitter as shownin FIG. 14, an uneven delay element fanout may result. According to theparticular application, buffers 130 as described above may optionally beused in implementations of transmitter 10 as shown in FIGS. 10-14.

[0083] It is possible but not necessary for the number of output signalsS20 to be an integer multiple of the number of sets of latches in thetransmitter. FIG. 15 shows an example in which an implementation 208 oftransmitter 10 having three sets of latches is arranged to drive aneight-bit bus.

[0084] Also, it is possible but not necessary for the delay elements tohave equal delay periods, or for the delays between sets of latches tobe equal. FIG. 16 shows an example in which a unit delay separates theclock signals CLK0 and D_CLK0 driving latches 110 a and 110 b,respectively, while a two-unit delay separates the clock signals D_CLK0and D3_CLK0 driving latches 110 b and 110 c, respectively. Other delaydistributions may be implemented according to the particular application(e.g. as indicated by simulations). Also, buffers 130 as shown in FIGS.15 and 16 may be optionally used according to the particularapplication.

[0085]FIG. 17 illustrates an application according to an embodiment ofthe invention that includes a transmitter 12 and transmission lines 20as described above. This application also includes a receiver 112configured to receive output signals S20 and clock signal CLK0 and toproduce received signals S60. Depending on factors such as a timerelation between clock signal transitions at the transmitter and clocksignal transitions at the receiver, the length of the delay betweencorresponding transitions on output signals S20 a and S20 b, and adesired relation between transitions on received signals S60, theimplementation of receiver 112 may vary according to the particularapplication. In an exemplary application, state transitions on signalsS60 are similarly timed with respect to each other.

[0086] As a consequence of a delay (whether inherent or deliberate) intransmitting a clock signal to receiver 112 (e.g. over one of thetransmission lines), it may be possible to use a signal based on clocksignal CLK0 to control the operation of latches 510 at the receiver.FIG. 18 shows an implementation 500 of receiver 112 according to such anembodiment of the invention. FIG. 19 shows an alternate implementation502 in which latches 512 b are configured to latch upon the othertransition of the clock signal.

[0087]FIG. 20 shows an implementation 504 of receiver 112 according toanother embodiment of the invention. In this implementation, a clocksignal supplied to latches 510 a is delayed by delay element 520-1 withrespect to a clock signal CLK0 as supplied to latches 510 b. In a casewhere output signals 20 b are transmitted having a delay with respect tosignals 20 a (e.g. as described above), a net effect may be achieved inwhich receiver output signals S60 a and S60 b are essentiallysynchronous, have essentially the same time relation as they did beforeentering the transmitter, and/or have some other desired time relation.

[0088] It may be advantageous to delay the data signals at the receiverinstead of delaying the clock signal, as clock delays may complicatedownstream synchronous logic operations. FIG. 21 shows an implementation506 of receiver 112 according to an embodiment of the invention in whichsignals S20 a are delayed by delay elements 520 before being inputted tolatches 510 a. As in the example of FIG. 20, in a case where signals 20b are transmitted having a delay with respect to signals 20 a, a neteffect may be achieved in which receiver output signals S60 a and S60 bare essentially synchronous, have essentially the same time relation asthey did before entering the transmitter, and/or have some other desiredtime relation.

[0089] A scheme of delaying a clock signal in the transmitter may becombined with a scheme of delaying alternating latch inputs in thereceiver, and vice versa, and either such scheme may also be used incombination with a scheme of using rising and falling edges to controllatches in the transmitter or receiver. Receivers as illustrated inFIGS. 18-21 may also be used with other implementations of transmitter10 as described herein.

[0090] In a method for reducing interaction between signals on nearbyconductors according to a further embodiment of the invention, signalson adjacent conductive paths pass through different alternatingsequences of inversions and regenerations.

[0091]FIG. 22 shows a block diagram of a system for data transmissionaccording to an embodiment of the invention. Transmitter 10 produces afirst set of output signals S30 a and a second set of output signals S30b. A first set of conductive paths 17 a receives the first set of outputsignals S30 a, and a second set of conductive paths 17 b receives thesecond set of output signals S30 b. In an exemplary implementation,conductive paths 17 are parallel to one another.

[0092] Each of the conductive paths 17 includes a transmission line 22that has a series of inverting buffers I and non-inverting buffers N.Inverting buffers I invert the state transitions of the signals theypass, and non-inverting buffers N regenerate the state transitions ofthe signals they pass. In the system shown in FIG. 22, each of thetransmission lines 22 has an alternating series of buffers, and thesequence of inversions and regenerations in the series of transmissionlines 22 a is different from (specifically, opposite to) the sequence inthe series of transmission lines 22 b.

[0093] When the same state transition occurs on two adjacent parallelconductors at substantially the same time (e.g. two rising edges), eachtransition tends to speed the propagation of the other along itsrespective transmission line. When opposite state transitions occur ontwo adjacent parallel conductors at substantially the same time (e.g. arising and a falling edge), each transition tends to slow thepropagation of the other along its respective transmission line.

[0094] In a typical application, the relations between transitions onadjacent transmission lines are not known a priori. For example, thedata values being transmitted typically are not known beforehand. As theresult, the slowing or speeding of propagation of a particulartransition due to nearby transitions becomes unpredictable, and anundesirable timing uncertainty may result.

[0095] In a system having an alternating and opposite arrangement ofinversions and regenerations as shown in FIG. 22, a transition passingfrom one end of a transmission line to the other will see the same (ornearly the same) number of similar state transitions and opposite statetransitions on an adjacent transmission line. As described below, thesystem may be designed such that this condition is largely independentof the relation of the state transitions originally driven onto adjacenttransmission lines 22, as is now described.

[0096]FIG. 23A shows an example in which a similar state transition istransmitted over two nearby transmission lines 22 a and 22 b, and FIG.23B shows an example in which opposite state transitions are transmittedonto the two transmission lines. In the example of FIG. 23A,transmitting a rising state transition over transmission lines 22 a, 22b causes the following pairs of propagating transitions to appear on thesegments of the two transmission lines (from left to right) after eachof the four buffers:

[0097] falling/rising, falling/falling, rising/falling, rising/rising.

[0098] In the example of FIG. 23B, transmitting a rising statetransition over transmission line 22 a and a falling state transitionover transmission line 22 b causes the following pairs of propagatingtransitions to appear on the segments of the two transmission lines(from left to right) after each of the four buffers:

[0099] falling/falling, falling/rising, rising/rising, rising/falling.

[0100] Although the pairs of propagating transitions appear in adifferent order in each case, one may see that in both cases, each ofthe four possible combinations occur once and only once. One may alsosee that the same is true for the other two possible input combinations(namely, a falling transition over both lines, and falling and risingtransitions on lines 22 a and 22 b, respectively). Therefore, eachtransition transmitted along one of these transmission lines will seethe same combination of transitions on the other line, regardless ofwhether the transitions are rising or falling, or similar or different.

[0101] In an application where each transition along transmission lines22 has the same magnitude, one may expect the effect of each transitionalong a transmission line to be substantially constant (i.e. withrespect to transitions on nearby transmission lines). Therefore, it maybe desirable to configure buffers I, N such that each buffer receives atransition of substantially equal magnitude. In implementing a system asshown in FIG. 22, for example, it may be desirable for opposing buffersin adjacent transmission lines 22 a, 22 b (e.g. the pair of buffers I1 a1 and N1 b 1) to be located at the same distance from transmitter 10.

[0102] It may also be desirable for each buffer to produce a transitionof substantially equal magnitude. It may also be desirable to place thebuffers of each transmission line such that each buffer receivestransitions having one uniform magnitude and produces transitions havinganother uniform magnitude. For example, it may be desirable to have auniform separation between the buffers of each transmission line 22.

[0103] As shown in FIG. 24, the signals carried by the parallelconductors may be used to drive one or more other sets of parallelconductors. A possible advantage of one such system is that a set ofparallel conductors may be tapped off of the transmission lines in ashort space, permitting transitions on the tapped conductors to havesubstantially equal magnitudes as well. For example, in an applicationcharacterized by a line pitch of 0.4 microns, an eight-bit bus may betapped off over a length of less than four microns.

[0104]FIG. 25 shows a block diagram of a system for data transmissionaccording to an embodiment of the invention. In this example, a pair ofpower rails 30 a, 30 b are situated parallel to and on opposite sides ofthe set of sonductive paths 17 a, 17 b (here, including transmissionlines 22). Power rails 30 a, 30 b may be coupled to provide an operatingvoltage to transmitter 10 and/or one or more of the buffers oftransmission lines 22, or these components may be powered from anothersource. In an exemplary implementation, power rails 30 a, 30 b (carryingrespectively Vcc and ground potentials) reduce interference by providinga well-defined return path for the signals transmitted across conductivepaths 17 a, 17 b. The arrangement of power rails 30 a, 30 b as shown inFIG. 25 may be used to similar effect in other embodiments describedherein that include a plurality of conductive paths, such as those shownin FIGS. 1, 3, 5, 17, 22, and 29.

[0105] Data transitions having the same clock dependence may be furtherseparated in space by combining a technique for separation in timebetween data transitions on adjacent conductors (e.g. as discussed abovewith reference to FIGS. 1-16) with a technique for passing signals onadjacent conductive paths through different alternating sequences ofinversions and regenerations (e.g. as discussed above with reference toFIGS. 22-25).

[0106] To illustrate one such example, FIG. 26 shows a combination of anapplication of a method according to an embodiment of the invention asshown in FIG. 10 with an application of a method according to anembodiment of the invention as shown in FIG. 22, such that similarlytimed signals transmitted on adjacent conductive paths pass throughdifferent alternating sequences of inversions and regenerations. FIG. 27shows another such combination in which adjacent conductive pathscarrying similarly timed signals include transmission lines havingdifferent alternating series of inverting and non-inverting buffers andare also separated by conductive paths carrying differently timedsignals.

[0107] In a method for reducing interaction between signals on nearbyconductors according to a further embodiment of the invention, datatransitions having the same clock dependence are separated in space. Inone such method, a first set of signals is transmitted in one directionon a first set of parallel conductors, and a second set of signals istransmitted in the opposite direction on a second set of parallelconductors that is interleaved with the first set.

[0108]FIG. 28 shows a block diagram of an application of two instances16-1, 16-2 of a transmitter according to an embodiment of the invention.In this application, transmitter 16 transmits output signals S40 on aset of conductive paths 32, and transmitter 16-2 transmits outputsignals S50 on a set of conductive paths 34. Conductive paths 32 and 34are arranged such that adjacent conductors of one set are separated byat least one conductor of the other set. In an exemplary application,transmitter 16 is an implementation of transmitter 10 as describedabove.

[0109]FIG. 29 shows a block diagram of an application of two instances18-1, 18-2 of a transmitter according to an embodiment of the invention.In this application, each transmitter 18 transmits each output signalS40, S50 on a corresponding one of a set of conductive paths, each pathincluding a parallel transmission line 26, such that lines carryingsignals S40 are interleaved with lines carrying signals S50. Eachtransmitter 18 also receives the clock signal CLK0. In an exemplaryapplication, transmitter 18 is an implementation of transmitter 10 asdescribed above.

[0110]FIG. 30 shows implementations 300-1 and 300-2 of a transmitteraccording to an embodiment of the invention that are applied to receiveclock signal CLK0 and input signals S12, S14 (where n is arbitrarilylarge) and to transmit corresponding output signals S40, S50 in aninterleaved fashion (e.g. as shown in FIGS. 28 and 29) over conductivepaths (not shown). Each among the sets of input signals S12, S14 may besimilar to input signals S10 as described above. Each transmitter 300includes a bank of latches 310, 312 that latch a value (e.g. state)received at an input onto an output upon a predetermined transition ofclock signal CLK0.

[0111] In a system as shown in FIG. 30, it may be desirable to avoidsending data transitions in both directions at once. For example, it maybe desirable for a time separation between transitions on an outputsignal (e.g. S40) to exceed the time required for the signal topropagate from one end of the corresponding conductive path to theother.

[0112] A time separation between output signals S40 and S50 may beachieved at least in part as a consequence of an inherent delay intransmitting clock signal CLK0 (e.g. over one of a set of conductivepaths 32 or parallel transmission lines 26) to transmitter 300-2.Alternatively, as shown in FIG. 31, such separation between outputsignals S40 and S52 may be achieved by arranging latches 310 of onetransmitter 300 to latch upon one of the transitions (e.g. the rising orfalling edges) of clock signal CLK0 and arranging latches 314 of theother transmitter 302 to latch upon the other transition of clock signalCLK0.

[0113]FIG. 32 shows a further application of transmitters 300-1 and300-2 in which a difference in timing between output signals S40 and S52is achieved at least in part by inserting a delay element 320 into thepath of clock signal CLK0 to transmitter 300-2. Such a delay element,for example, may be incorporated into transmitter 300-2 and/or mayreceive clock signal CLK0 over one of a set of conductive paths carryingoutput signals S40, S52.

[0114]FIG. 33 shows a block diagram of an application includingimplementations 300 and 304 of a transmitter according to an embodimentof the invention that are applied to receive input signals S12, S14 andtransmit corresponding output signals S40, S52. In this case, the latchoutput signals of latches 312 are delayed by delay elements 330 beforetransmission over the conductive paths (not shown). Buffers as describedabove may also be optionally used with transmitter implementations asshown in FIGS. 28-33.

[0115] Data transitions may be further separated by combining atechnique for passing signals on adjacent conductive paths throughdifferent alternating sequences of inversions and regenerations (e.g. asdiscussed above with reference to FIGS. 22-25) with a technique fortransmitting signals on interleaved sets of parallel conductors (e.g. asdiscussed above with reference to FIGS. 28-33). To illustrate one suchexample, FIG. 34 shows a combination of a method according to anembodiment of the invention as shown in FIG. 28 with a method accordingto an embodiment of the invention as shown in FIG. 22. In this example,signals on adjacent transmission lines are transmitted in oppositedirections, while adjacent transmission lines carrying signals in thesame direction include different alternating series of inverting andnon-inverting buffers. FIG. 35 shows another such combination in whichthe transmission lines 22 are arranged in alternating pairs, each paircarrying signals in the same direction through different alternatingseries of inverting and non-inverting buffers.

[0116] Similarly timed data transitions may be further separated inspace by combining a technique for separation in time between datatransitions on adjacent conductors (e.g. as discussed above withreference to FIGS. 1-16) with a technique for transmitting signals oninterleaved sets of parallel conductors (e.g. as discussed above withreference to FIGS. 28-33). To illustrate one such example, FIG. 36 showsa combination of an application of a method according to an embodimentof the invention as shown in FIG. 10 with an application of a methodaccording to an embodiment of the invention as shown in FIG. 29. Thisparticular example also includes a delay element 320 as shown in FIG. 32implemented as an inverter 420.

[0117] In the example shown in FIG. 36, the latches of transmitter 306-2receive an inversion of clock signal CLK0. In another implementation,inverter 420 may be included within the transmission line or within oneof the transmitters. In an alternate implementation, latches of onetransmitter (e.g. latches 110 a 1-110 c 3 of transmitter 306-1) areconfigured to latch upon one of the transitions of clock signal CLK0,while latches of the other transmitter (e.g. latches 110 a 4-110 c 6 oftransmitter 306-2) are configured to latch upon the other transition ofclock signal CLK0 (e.g. as shown in FIG. 31).

[0118] Moreover, a technique for separation in time between datatransitions on adjacent conductors (e.g. as discussed above withreference to FIGS. 1-16) may be combined with a technique for passingsignals on adjacent conductive paths through different alternatingsequences of inversions and regenerations (e.g. as discussed above withreference to FIGS. 22-25) and also with a technique for transmittingsignals on interleaved sets of parallel conductors (e.g. as discussedabove with reference to FIGS. 28-33).

[0119] Several different sequences of the individual conductive pathsare possible for each such combination, e.g. as discussed with regard tothe combinations described above. In one variation, for example, fouradjacent conductive paths may carry differently timed signals in thesame direction, while in another variation four adjacent conductivepaths carry similarly timed signals in two different directions andthrough two different alternative sequences of inversions andregenerations. Simulations may be performed to determine the suitabilityof a particular combined scheme for a particular application.

[0120] The foregoing presentation of the described embodiments isprovided to enable any person skilled in the art to make or use thepresent invention. Various modifications to these embodiments arepossible, and the generic principles presented herein may be applied toother embodiments as well. For example, the invention may be implementedin part or in whole as a hardwired circuit or as a circuit configurationfabricated into an application-specific integrated circuit. Thus, thepresent invention is not intended to be limited to the embodiments shownabove but rather is to be accorded the widest scope consistent with theprinciples and novel features disclosed in any fashion herein.

What is claimed is:
 1. A method of data transmission, said methodcomprising: transmitting each among a first set of signals on acorresponding one of a first set of a plurality of parallel conductivepaths, and transmitting each among a second set of signals on acorresponding one of a second set of the plurality of parallelconductive paths, wherein adjacent conductive paths of the first set areseparated by at least one conductive path of the second set, and whereina first of two ends of each one among the plurality of conductive pathsis closer to the first end of an adjacent conductive path than to thesecond end of the adjacent conductive path, and wherein saidtransmitting each among a first set of signals includes applying thesignal to the first end of the corresponding conductive path, andwherein said transmitting each among a second set of signals includesapplying the signal to the second end of the corresponding conductivepath.
 2. The method of data transmission according to claim 1, whereineach among the first and second sets of signals includes a series ofstate transitions, and wherein a propagation delay of a state transitionacross one of the first set of the plurality of parallel conductivepaths is less than a time interval between consecutive state transitionsof one of the first set of signals.
 3. The method of data transmissionaccording to claim 1, wherein said transmitting each among a first setof signals and said transmitting each among a second set of signalsoccur on the same semiconductor substrate.
 4. The method of datatransmission according to claim 3, wherein a length of each of theparallel conductive paths is at least five centimeters.
 5. The method ofdata transmission according to claim 1, wherein a distance between apair of the parallel conductive paths is less than one hundred microns.6. The method of data transmission according to claim 1, wherein a widthof each of the parallel conductive paths is less than one hundredmicrons.
 7. A system for data transmission, said system comprising: aplurality of conductive paths; a first transmitter configured andarranged to receive a plurality of first input signals, each having aseries of state transitions, and to transmit a corresponding pluralityof first output signals, each having a series of state transitionscorresponding to the series of state transitions of the correspondingfirst input signal; and a second transmitter configured and arranged toreceive a plurality of second input signals, each having a series ofstate transitions, and to transmit a corresponding plurality of secondoutput signals, each having a series of state transitions correspondingto the series of state transitions of the corresponding second inputsignal, wherein a first of two ends of each one among the plurality ofconductive paths is closer to the first end of an adjacent conductivepath than to the second end of the adjacent conductive path, and whereinthe first transmitter is further configured and arranged to apply eachfirst output signal to the first end of the corresponding conductivepath, and wherein the second transmitter is further configured andarranged to apply each second output signal to the second end of thecorresponding conductive path, and wherein adjacent conductive pathscarrying first output signals are separated by at least one conductivepath carrying a second output signal.
 8. The system for datatransmission according to claim 7, wherein each state transition of anoutput signal corresponds to a different one among the state transitionsof the corresponding input signal.
 9. The system for data transmissionaccording to claim 7, wherein the conductive paths are parallel to oneanother.
 10. The system for data transmission according to claim 7,wherein the first and second transmitters are fabricated on the samesemiconductor substrate.
 11. The system for data transmission accordingto claim 10, wherein a length of each of the conductive paths is atleast five centimeters.
 12. The system for data transmission accordingto claim 7, wherein a distance between a pair of the conductive paths isless than one hundred microns.
 13. The system for data transmissionaccording to claim 7, wherein a width of each of the conductive paths isless than one hundred microns.
 14. The system for data transmissionaccording to claim 7, wherein each of the first and second transmittersis further configured and arranged to receive an operating voltage fromtwo power rails, and wherein the two power rails are parallel to and onopposite sides of the plurality of conductive paths.
 15. The system fordata transmission according to claim 7, wherein each one among theplurality of conductive paths includes a corresponding one of aplurality of parallel transmission lines, and wherein the statetransitions of each among the plurality of first output signals aresynchronous to a clock signal, and wherein the first transmitter isfurther configured and arranged to couple the clock signal to one of theplurality of parallel transmission lines.
 16. The system for datatransmission according to claim 7, wherein each among the plurality ofconductive paths includes a corresponding one of a plurality of buffers.17. The system for data transmission according to claim 7, wherein thestate transitions of each among the plurality of first input signals andof each among the plurality of second input signals are synchronized toa data clock signal, and wherein the state transitions of each among theplurality of first output signals are synchronous to one among therising and falling edges of a clock signal based on the data clocksignal, and wherein the state transitions of each among the plurality ofsecond output signals are synchronous to the other among the rising andfalling edges of the clock signal based on the data clock signal.
 18. Asemiconductor substrate having an integrated circuit fabricated thereon,said integrated circuit comprising: a plurality of conductive paths; afirst transmitter configured and arranged to transmit a plurality offirst output signals; and a second transmitter configured and arrangedto transmit a plurality of second output signals, wherein a first of twoends of each one among the plurality of conductive paths is closer tothe first end of an adjacent conductive path than to the second end ofthe adjacent conductive path, and wherein the first transmitter isfurther configured and arranged to apply each first output signal to thefirst end of the corresponding conductive path, and wherein the secondtransmitter is further configured and arranged to apply each secondoutput signal to the second end of the corresponding conductive path,and wherein adjacent conductive paths carrying first output signals areseparated by at least one conductive path carrying a second outputsignal.
 19. The semiconductor substrate according to claim 18, wherein alength of each of the conductive paths is at least five centimeters. 20.The semiconductor substrate according to claim 18, wherein each amongthe plurality of conductive paths includes a corresponding one of aplurality of buffers.